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Why IntelliSuite Clean Room - 12 Reasons
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Microloading (loading effect) and DRIE-lag (ARDE) simulation.
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Blueprint-- Professional Mask Editor
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Fast simulations that match the experiments
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Extensive database
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High-index off-cut substrates beyond standard wafer orientations and flats
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Different etch rates for Si(111) depending on the inclination angle
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Characterize your etchant to understand how it etches
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Convex corner undercutting and compensation
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Complex processing with multiple etching steps
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Submicron, nanoscale etching
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Diffusion-limited isotropic etching
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Up to three cross-sections with geometrical measurements
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